MMBD4448V
Document number: DS30451 Rev. 7 - 2
1 of 2
www.diodes.com
March 2008
? Diodes Incorporated
MMBD4448V
SURFACE MOUNT FAST
SWITCHING DIODE
Features
?
Ultra-Small Surface Mount Package
?
Fast Switching Speed
?
For General Purpose Switching Applications
?
High Conductance
?
Lead Free By Design/RoHS Compliant (Note 4)
?
"Green" Device (Note 5 and 6)
Mechanical Data
?
Case: SOT-563
?
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
?
Moisture Sensitivity: Level 1 per J-STD-020D
?
Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
?
Marking Information: See Page 2
?
Ordering Information: See Page 2
?
Weight: 0.003 grams (approximate)
SOT-563
TOP VIEW
Internal Schematic
C1
A1
NC
NC
A2
C2
TOP VIEW
BOTTOM VIEW
Maximum Ratings
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Non-Repetitive Peak Reverse Voltage
VRM
100
V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
80
V
RMS Reverse Voltage
VR(RMS)
57
V
Forward Continuous Current (Note 2)
IFM
500
mA
Average Rectified Output Current (Note 2)
IO
250
mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0s
IFSM
4.0
2.0
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 2)
PD
150
mW
Thermal Resistance Junction to Ambient (Note 2)
RθJA
833
°C/W
Operating and Storage Temperature Range
TJ , TSTG
-65 to +150
°C
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 3)
V(BR)R
80
?
V
IR
= 2.5
μA
Forward Voltage
VF
0.62
?
?
?
0.72
0.855
1.0
1.25
V
IF
= 5.0mA
IF
= 10mA
IF
= 100mA
IF
= 150mA
Leakage Current (Note 3)
IR
?
100
50
30
25
nA
μA
μA
nA
VR
= 70V
VR
= 75V, T
J
= 150
°C
VR
= 25V, T
J
= 150
°C
VR
= 20V
Total Capacitance
CT
?
3.5
pF
VR
= 6V, f = 1.0MHz
Reverse Recovery Time
trr
?
4.0
ns
VR
= 6V, I
F = 5mA
Notes: 1. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration pulse test used to minimize self-heating effect.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our webs
ite at http://www.diodes.com/products/lead_free/index.php.
6. Product manufactured with Date Code UO (week 40, 2007) an
d newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
2O3
Fire Retardants.
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